Thermodynamics Homework 1 Solution

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Briefly define the following: kWh CO2e GHG Activity factor (for microprocessor) Dynamic switching energy N-type and p-type semiconductor NMOS and PMOS (draw symbols, mark current direction, source, drain) CMOS Local interconnect Global interconnect Sheet resistance Answer the following questions: Describe why capacitor and inductor can give delay. Use a formula to explain why IBM airgap…

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  1. Briefly define the following:

    1. kWh

    1. CO2e

    1. GHG

    1. Activity factor (for microprocessor)

    1. Dynamic switching energy

    2. N-type and p-type semiconductor

    1. NMOS and PMOS (draw symbols, mark current direction, source, drain)

    1. CMOS

    2. Local interconnect

    1. Global interconnect

    1. Sheet resistance

  1. Answer the following questions:

    1. Describe why capacitor and inductor can give delay.

    1. Use a formula to explain why IBM airgap process is better (in terms of switching speed and switching energy).

    1. Why is it more convenient to use sheet resistance to model interconnects?

  1. The current leader of the Top500 supercomputer table (https://www.top500.org/lists/2017/11/ ) is the Sunway TaihuLight (National Supercomputing Center, Wuxi, China), which has a peak performance of 125*1015 Flop/s (“Flop/s” means floating point operations per second, which characterizes computing device performance) and a power consumption of 15,000 kW.

    1. Calculate the number of computations per kWh

    1. Given that an average Canadian home consumes 11,000 kWh per year of electricity, how many homes could be run on the power consumed by this supercomputer?

  1. a) Using the model for interconnect power given in class (in the notes, lecture 2.2: Interconnect

(III)), extend the model to obtain equations for i) interconnect delay and ii) energy for a buffered line, where we divide the total line length L into N segments.

b) Obtain an expression for the value of N which minimizes the delay

Thermodynamics Homework 1 Solution
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